
CS5361
10
DS467F2
DC ELECTRICAL CHARACTERISTICS
GND = 0 V, all voltages with respect to ground. MCLK=12.288 MHz; Master Mode.
Notes: 8. Power Down Mode is defined as RST = Low with all clocks and data lines held static.
9. Valid with the recommended capacitor values on FILT+ and VQ as shown in the Typical Connection
Diagram.
DIGITAL CHARACTERISTICS
THERMAL CHARACTERISTICS
Parameter
Symbol
Min
Typ
Max
Unit
Power Supply Current
VA = 5 V
(Normal Operation)
VL,VD = 5 V
VL,VD = 3.3 V
IA
ID
-
17.5
22
14.5
21.5
27.5
17
mA
Power Supply Current
VA = 5 V
(Power-Down Mode) (Note
8)VL,VD = 5 V
IA
ID
-
100
-
A
Power Consumption
(Normal Operation)
VA, VD, VL = 5 V
VA = 5 V, VL, VD = 3.3 V
(Power-Down Mode)
-
198
135
1
243
161
-
mW
Power Supply Rejection Ratio
(1 kHz)
PSRR
-
65
-
dB
VQ Nominal Voltage
Output Impedance
Maximum allowable DC current source/sink
-
2.5
25
0.01
-
V
k
mA
Filt+ Nominal Voltage
Output Impedance
Maximum allowable DC current source/sink
-
5
15
0.01
-
V
k
mA
Parameter
Symbol
Min
Typ
Max
Units
High-Level Input Voltage
(% of VL)
VIH
70%
-
V
Low-Level Input Voltage
(% of VL)
VIL
--
30%
V
High-Level Output Voltage at Io = 100 A(% of VL)
VOH
70%
-
V
Low-Level Output Voltage at Io = 100 A(% of VL)
VOL
--
15%
V
OVFL Current Sink
Iovfl
--
4.0
mA
Input Leakage Current (all pins except SCLK and LRCK)
Iin
-10
-
10
A
Input Leakage Current (SCLK and LRCK)
Iin
-25
-
25
A
Parameter
Symbol
Min
Typ
Max
Unit
Allowable Junction Temperature
-
135
°C
Junction to Ambient Thermal Impedance
(Multi-layer PCB) TSSOP
(Multi-layer PCB) SOIC
(Single-layer PCB) TSSOP
(Single-layer PCB) SOIC
θ
JA-TM
θ
JA-SM
θ
JA-TS
θ
JA-SS
-
70
60
105
80
-
°C/W